Hot dipping technology process

Hot dipping technology uses impregnation, with preheating of components, to process highly viscous impregnation media. The newer, low-monomer or monomer-free resins are usually significantly more viscous than conventional solvent-based resins.

When preheated components are immersed, the viscosity of the resin is reduced at the interfaces between object and resin. This significantly increases penetration. Gelling can be achieved very quickly thanks to the direct heating of the component. Significantly more resin remains in the windings, resulting in improved dielectric, thermal and mechanical properties.

The terms “electrothermics” or “electric heat” are generic terms for all heating processes based on electrical engineering principles. Applications of this method include resistance heating, induction heating and microwave heating. This process is used in various applications, such as soldering, hardening, welding, tempering, annealing, melting, impregnation, etc.

Our current heat-impregnation methods are based on the principle of resistance heating. Here the connection ends of the stator windings are brought into contact with each other and have a DC or low frequency current passed through them. This current heats up the winding and adjacent parts. This principle is based on the Joule effect.

Additional hardening can be achieved by using an infrared cabin (HT-IR), ultraviolet (UV) cabin (HAT-UV) or a convection oven.

In our induction heating process, the laminated core is heated using an induction coil. The laminated core absorbs the heat very effectively and distributes it uniformly over the copper windings. No direct electrical contact is necessary. The different electrical factors of different stators are not relevant. Geometric forms, such as the length and diameter of the laminated core, are variable.

Both the resistance heating and induction heating methods provide optimum impregnation results. The choice of which of these two methods should be used depends on the specific application.